April 2024
AIE-PN33/43: Embedded fanless PC with NVIDIA Jetson Orin NX
Aetina Corporation introduces AIE-PN33/43, the new fanless Edge Computing platform based on NVIDIA Jetson Orin NX and suitable for all those AI applications in smart city and smart agriculture where maintenance, performance and reliability are of crucial importance. AIE-PN33/43 integrates 8GB or 16GB Jetson Orin NX, up to 5 times more powerful than the previous generation, and offers up to 100 TOPS, 1024 NVIDIA Ampere cores and 32 Tensor cores, thus setting a new standard for mainstream edge AI devices. AIE-PN33/43 offers extensive I/O including two GbE LANs, up to four GbE POEs, two USB 3.2 Gen2, one USB Type C (OTG), two COMs, one HDMI and one CANBus. In addition, the AIE-PN33/43 can be equipped with WIFI/BT and LTE/5G via M.2 expansion slots, while 128GB of storage is already integrated via an M.2 NVMe module. The embedded platform AIE-PN33/43 has dimensions of 270x195x80 mm and supports wall and DIN-RAIL mounting, an operating temperature from -25°C to +55°C and a 12-24VDC power supply for industrial applications.
April 2024
Express-RLP: COM Express Type 6 with Intel Core 13th Gen Raptor Lake-P
ADLINK introduces Express-RLP, the new COM-Express Type 6 module equipped with 13th generation processors and based on the Raptor Lake-P platform. The hybrid architecture with P-core (performance) and E-core (efficiency) ensures high performance together with low power consumption. The high scalability of integrable CPUs, from i3 up to i7, makes Express-RLP an versatile solution that can be easily integrated to realise customised embedded boards. The Express-RLP module’s managed RAM memory is expandable up to a maximum of 64GB DDR5 on dual SODIMM sockets, while the video compartment is managed so as to guarantee the simultaneous and independent connection of up to four of the available ports: DisplayPort, HDMI, LVDS, eDP, VGA. Express-RLP also features 4x USB 3.2 ports, 4x USB 2.0, 2x SATA 6Gb/s, 2x UART, 8x GPIO, and support for NVMe-type SSDs. Express-RLP is available in a standard version with an operating temperature from 0°C to +60°C or in an Extreme Rugged version with an extended operating temperature from -40°C to +85°C.
April 2024
XRS 3U S8: Extreme Rugged Edge Server with 4th/5th generation Intel Xeon Scalable Processors
Goma Elettronica SpA announces XRS 3U S8, the new family of Extreme Rugged Servers optimized for Edge applications, where they offer superior robustness and high-performance computing technology. The XRS 3U S8 Series is powered by single or dual socket 5th/4th Gen Intel Xeon Scalable Processors that bring significant advancements in core counts, memory capacities, AI and machine learning acceleration, advanced security features, and PCIe 4.0/5.0 support, establishing the series as a foundational element for the future of high-performance and AI-driven Edge applications. This series features a 3U milled aluminium chassis providing unmatched resistance and torsional strength essential for Edge computing sites, which often face extreme operational demands. It offers configurations with depths of 470mm or 550mm for standard or round MIL-grade I/O connectors and is capable of accommodating up to six full-height, full-length PCIe boards, and designed for high density storage with the capacity for up to twelve removable SSDs. Qualified according to MIL-STD-810G for temperature, shocks, and vibrations, and conforming to MIL-STD-461 for EMI/EMC, the XRS Series Extreme Rugged Edge Servers are robustly built to meet the stringent requirements of Edge computing environments.
April 2024
Talon RGD2443W: 24-inch Rugged Monitor
Eizo Rugged Solutions introduces Talon RGD2443W, the new 24-inch 4K UHD rugged monitor in 16:9 aspect ratio (3840 x 2160) designed for harsh environments. In fact, Talon RGD2443W is ideal for military environments, where devices must be able to operate in harsh environments without sacrificing performance. Talon RGD2443W is IP65 on both front and rear (excluding connectors), while the panel features a capacitive touch screen, anti-glare and anti-fingerprint coating. In terms of I/O, Talon RGD2443W has two Display Ports, two HDMI and USB, RS-232C and RS-485 communication interfaces. This monitor also has -20 /+55°C operating temperature and 18-36VDC power supply, which is also available in AC upon request. On every Talon monitor, EIZO performs vibration, shock, humidity, decompression and extreme temperature testing at its own in-house durability test center to meet MIL-STD-810 and MIL-STD-461 standards. Talon RGD2443W features several optionals including ‘EIZO LCD Flicker Compensation’ (E-LFC), ‘Image Enhancement Technology’ and the addition of handles, while options and variants such as EMI filters, NVIS screens, custom connectors and special formats can be easily realised upon request.
March 2024
BCO-1000-EHL-J6413-30C: Industrial fanless PC with Celeron J6413 EHL and 4 expansion slots
C&T introduces BCO-1000-EHL-J6413-30C, the new Fanless Embedded Computer based on the Intel Celeron J6413 Elkhart Lake SoC featuring up to four expansion slots simultaneously. The BCO-1000-EHL-J6413-30C is the ideal solution for various applications in the industrial field such as automation, control, kiosks and digital signage where competitive cost is a key factor for choice.
The BCO-1000-EHL-J6413-30C features a DDR4 SO-DIMM memory slot for up to 32GB and 3200MHz and a wealth of I/Os such as two Display Ports, an internal bay for 2.5″ SATA HDDs up to 9.5mm, an mSATA slot (shared with a Mini PCI Express), an external SIM slot, two COMs, one GbE, one 2.5GbE, two CAN, three USB 3.2 Gen2 and one USB 2.0, which can be further expanded by integrating up to four expansion slots including one DP, one HDMI, four USB and two additional COMs respectively. The voltage input has an extended range from 9V to 36V DC to ensure maximum system reliability. In addition, the BCO-1000-EHL-J6413-30C is designed to withstand constant shock and vibration and to operate in harsh environments. The clean and compact design ensures easy integration, effortless expandability and trouble-free maintenance with extended operation from -20°C to 50°C.
March 2024
UPC-F12M1-ADLP: Fanless 12.1″ industrial Panel PC based on Alder Lake P platform
IEI Technology introduces the UPC-F12M1-ADLP, the innovative Fanless Industrial Panel PC with 12.1″ (4:3) display and 12th generation Intel Core Celeron 7305E or i5-1250PE processor based on Alder Lake P architecture. The UPC-F12M1-ADLP Panel PC is available with PCAP touchscreen and anti-glare coating and features a high degree of protection Full IP66, which guarantees extreme protection of the entire device against exposure to dust and liquids. The new UPC-F12M1-ADLP Panel PC is equipped by default with 8GB of RAM memory and numerous I/O interfaces via M12A connectors including a COM port, four USB 2.0, a GbE LAN and a CANBUS. On the storage side, the UPC-F12M1-ADLP offers the option to install two NVMe SSDs in M.2 M-Key format on PCIe Gen3 BUS for ultra-high-speed data transfer. UPC-F12M1-ADLP is equipped with an extended 9V-36V DC power supply via M12 connector, extended operation from -20°C to +60°C, and can be used in all applications where an IP66 frontal protection is not sufficient, and therefore complete protection is required.
March 2024
GAP-245P-S8: Rugged 2U Server with Front I/O and PSU and six PCIe FHHL slots
Goma Rugged Solutions unveils the GAP-245P-S8, a cutting-edge Rugged Server featuring dual processors that leverage the 5th/4th generation Intel Xeon Scalable architecture. This architecture is the pinnacle of Intel’s server design, offering enhanced AI application acceleration and integrated security capabilities. The GAP-245P-S8 is engineered for 19″ rack mounting within a 2U chassis, boasting a depth of just 450mm, and is designed with front-facing I/O and power input ports for easy accessibility. It supports various storage configurations, including two onboard M.2 NVMe SSDs, with the option to add either a removable 2.5-inch SAS SSD, up to two removable NVMe U.2 SSDs, or up to three removable 2.5-inch SATA SSDs. This rugged server can also house up to six horizontal PCIe FHHL cards, ensuring ample expandability. Designed to withstand the most demanding conditions, the GAP servers comply with the rigorous MIL-STD-810F standards for temperature and shock resistance, as well as the MIL-STD-167-1A standards for vibration resilience. Optional MIL-STD-461 compliance for EMI/EMC is available upon request. For enhanced durability and security, military-grade connectors for I/O ports and power inputs can be added, further enhancing its utility in challenging environments.
March 2024
Panther DH8: Full-Rugged 5.7″ Handheld
Roda Computer indtroduces Panther DH8, the new fully rugged handheld computer with a 5.7″ display and based on Intel Atom Elkhart Lake processor. Panther DH8 is the lightest model in the product range with 890g. Despite its small size, the available interfaces are 1x USB 3.1 Gen2 Type C and 1x Docking connector (POGO-pin), while 3x Fischer military connectors can optionally be added to the bottom of the device. As far as RAM is concerned, the DH8 supports up to 32GB, while for storage the maximum available size is 1TB on SSDs in M.2 SATA3 format. On the connectivity side, it can be equipped with Wi-Fi 6 and Bluetooth 5.2, while on the power supply side, the DH8 is equipped with two 7.4V, 2500 mAh hot swappable Li-ion batteries to allow the system to remain active for as long as possible. The Panther DH8 handheld is certified IP65, but an IP67 version is also available on request. As far as military certifications are concerned, the Panther DH8 is MIL-STD-810H and MIL-STD-461G Ground Navy certified, and optionally MIL-STD 461G Ground Army certified.
March 2024
TXMC639: XMC with User-Reconfigurable FPGA for Multi I/O
TEWS introduces TXMC639, the new XMC module featuring a user-configurable AMD Kintex 7 FPGA with up to 16 differential ADC input channels and 8 single-ended DAC output channels. Each ADC channel has 16-bit resolution and can operate at up to 1.5 Msps, with configurable differential input voltage ranges, while each DAC output is configurable as a single-ended bipolar analogue output with selectable voltage ranges. The module also offers 32 ESD-protected TTL lines for a flexible digital interface, all individually programmable as input or output. In addition, 16 of these TTL lines can be switched via the Board Configuration Controller (BCC) to provide 8 RS422 interfaces. TXMC639 FPGA is connected to a 1 GB DDR3L SDRAM and module configuration can be performed via SPI flash, BCC or JTAG interface, with support for PCIe specification compliance. The TXMC639 comes with the reference design of the FPGA board, which can be programmed via the integrated Board Configuration Controller (BCC). Programming via the JTAG interface using a USB programmer is also possible. In accordance with PCI specifications and PCI header data buffering, the content of the user FPGA can be changed during operation. TXMC639 module is the ideal COTS solution for industrial applications where specialised I/Os and guaranteed long-term availability of the FPGA-based design are required, enabling a fully customised interface.
February 2024
IBOX-600: Ultra-compact fanless PC for Edge AI with Jetson Orin NX/Nano
Sintrones introduces IBOX-600, the ultra-compact fanless computer for Edge AI applications equipped with NVIDIA Jetson Orin NX or Nano, with LPDDR5 memory up to 16GB for the NX version and 8GB for the Nano version. Despite its small size, the IBOX-600 can guarantee a computing power of up to 100TOPS and 1024 CUDA cores, while maintaining excellent levels of efficiency. Thanks to the various interfaces available, including GbE ports in M12 or RJ45 format, USB 3.2, HDMI, serial ports and CAN Bus, this PC offers great adaptability to various applications including in-vehicle networking, the use of Lidar-type connections and connections to cameras and sensors. As for storage, a 480GB NVMe SSD is already integrated on board. IBOX-600 also supports a wide range of wireless connectivity solutions via M.2 modules, including 5G, LTE, GPS, Wi-Fi and Bluetooth. The IBOX-600 supports extended power input 9V-60VDC with short-circuit protection and Smart Power Management function and is equipped with a UPS to prevent sudden shutdown in case of a power failure. The new IBOX-600 is made of aluminium and can operate in extreme weather conditions thanks to an operating temperature from -25°C to +70°C.
February 2024
MXE-230: Ultra Compact Rugged Embedded Computer with Intel N97 Alder Lake N
Adlink Technology introduces the MXE-230, the Intel N97 Alder Lake-N based ultra-compact fanless computer series. Despite its small size, it features a variety of I/O, including one USB 3.2 Gen2, three USB 2.0, two COM ports, one HDMI, one DP and two LAN ports. MXE-230 also supports a wide range of wireless connectivity solutions via M.2 modules, including 4G/LTE, GPS, Wi-Fi and Bluetooth. As for storage, either a SATA SSD or a faster M.2 M Key SSD on PCIe x2 interface can be integrated. The MXE-230 series offers high graphics and data processing performance, making it the ideal platform for industrial automation, facial recognition, intelligent transportation, in-vehicle entertainment (IVI), M2M (Machine to Machine) and IoT (Internet of Things) applications. MXE-230 is powered by an AC-DC power adapter, being equipped with a 12V-24VDC jack connector, and offers an operating temperature range from -20°C to +60°C.
February 2024
GAP-247RL-S8: 2U rugged server with dual 5th/4th Gen Intel Xeon Scalable Processors
Goma Rugged Solutions presents the GAP-247RL-S8, the new Rugged Server with dual processors based on 5th/4th generation Intel Xeon Scalable, the latest Intel server architecture with advanced acceleration for AI applications and integrated security features. The rugged server GAP-247RL-S8 is designed to be rack-mounted in a 19″ rack and housed in a compact 2U chassis, with a depth of only 470mm and rear I/O ports and power input. Storage options include two onboard M.2 NVME SSDs and a choice of three removable 2.5″ SAS SSDs, six removable U.2 NVMe SSDs, or up to nine removable 2.5″ SATA SSDs. Additionally, GAP-247RL-S8 rugged servers can accommodate up to six low-profile PCIe cards. GAP servers are meticulously designed to meet the high MIL-STD-810F standards for temperature and shock, as well as MIL-STD-167-1A standards for vibration. Furthermore, they can be configured to comply with MIL-STD-461 standards for EMI/EMC when required. Upon request, they can be equipped with military-grade connectors for I/O ports and power inputs, further expanding their versatility.
February 2024
AP-K32: 32-inch professional display with 4K resolution and aluminium front bezel
Austin Hughes introduces AP-K32, the new 32-inch 4K UHD display with 3840 x 2160 ultra-high definition resolution, designed for 24-hour operation. AP-K32 professional display has true 10-bit input that enables the display of 1.07 billion colours ensuring extremely high image quality and 300 cd/m² brightness. AP-K32 offers Display port 1.2, HDMI 1.4, HDMI 2.0 and optional 3G/HD/SD-SDI inputs, capacitive or infrared multi-touch function, anti-glare and anti-vandal glass, and 24/48/125VDC power input. AP-K32 also optionally offers the “Video Management & Transmission over Network” function, which allows multiple monitors to be managed and transmitted remotely, and supports the “Embedded Portrait Mode Module” function for using the display in portrait mode. AP-K32 professional display has an operating temperature from 0°C to +55°C and a high level of resistance to shock and vibration.
February 2024
MKB104: MIL grade Rugged Full Travel Keyboard
NSI introduces MKB104, the new rugged keyboard with long-travel keys designed and tested according to MIL-STD-810G and MIL-STD-461G standards, providing users with a highly reliable input device for various critical applications. The aluminum structure offers excellent shock resistance, electrical shielding, and environmental protection, ensuring high levels of corrosion resistance. The new MKB104 keyboard features dimmable backlit keys and rugged Amphenol connectors, and is available in desktop or panel mount versions. MKB104 operates reliably in extended temperatures ranging from -40°C to +70°C, making it ideal for use in critical environments.
January 2024
RCO-6000-RPL: Fanless Box PC with 13th Gen. Intel Core
C&T Solutions introduces RCO-6000-RPL, the new family of fanless embedded computers featuring 13th generation Intel Core processors with Raptor Lake architecture. RCO-6000-RPL embedded PC allows for the installation of up to 64GB of DDR5 RAM and provides a wide selection of I/O ports, integrated on both the front and rear panels. These include 1x DVI-I and 2x DisplayPort with independent outputs, 2x COM, 2x RJ45 2.5 GbE with teaming support, 8x USB 3.2 Gen.2, and 8x isolated DIO. For data storage, it is possible to integrate up to 2x 2.5” HDD or SSD, one of which is removable, and an M.2 SSD. Additionally, RCO-6000-RPL offers 2x mPCIe sockets that can be used for wireless LTE, 3G, GSM, and WLAN communications. Optionally available expansion modules allow for extending the I/O capabilities by integrating 4x RJ45 GbE, 2x RJ45 10GbE, or 4x mutually exclusive M12 GbE. With its high-strength monoblock aluminum enclosure and specially selected hardware, RCO-6000-RPL series offers extended operation from -25°C to +70°C and supports a power supply range of 9-48Vdc.
January 2024
DLAP-211-Orin NX: Industrial box PC equipped with NVIDIA ORIN NX module
Adlink Technology introduces DLAP-211-Orin NX, the new Edge Computing platform for industrial AI applications based on the NVIDIA Jetson Orin NX. Ideal for accelerating deep learning workloads for object detection, recognition, and classification, DLAP-211-Orin NX integrates the powerful Jetson Orin NX featuring Arm Cortex-A78AE CPU and an NVIDIA Ampere architecture GPU with 1024 Cores and 32 Tensor Cores, with 8GB or 16GB of LPDDR5 RAM. DLAP-211-Orin NX features a compact footprint of 148 x 120 x 52 mm, supports wall mounting or DIN rail mounting, and operates in extended temperature range of -20°C to +70°C, suitable for industrial and outdoor environments. The new AI platform, DLAP-211-Orin NX, provides 2x GbE, 4x USB 3.0, 1x lockable HDMI 2.0, 1x COM, and 1x CANBus. Optionally available features include 8x Digital Input Output (DIO) channels, 2x I2C, 2x SPI, and 1x UART. For data storage, are offered 16GB eMMC SSD, an SD slot (also compatible with micro SD), and a miniPCIe slot with a micro SIM socket.
