COM-HPC-sIDH | COM-HPC Ampere Altra | |
SoC | New Gen Intel® Xeon® D-2700 processor (formerly “Ice Lake-D HCC”) | Ampere Computing, Ampere Altra Series Processors Q80-28 80 cores, 2.6(2.8)GHz, 175W TDP Q32-17 32 cores, 1.5(1,7)GHz, 58W TDP |
Memory | 384 GB DDR4 at 2666 MT/s | Up to 768 GB DDR4 at max. 3200 MT/s |
BIOS | AMI Aptio V | AMI Aptio V |
Ethernet KR | Up to 256GB (4x 64GB) DDR4 RDIMM memory, Up to 3200MT/s Up to 512GB (4x 128GB) DDR4 LRDIMM memory (TBC) |
Up to 8x 10GBASE-KR (25G, 40G, 100G, TBC) |
NBASE-T Ethernet |
Intel I225 Up to 2.5GbE | Intel i225 Up to 2.5GbE |
Remote Mgmt | Dedicated PCIe for carrier BMC, mainly used for KVM (carrier BMC emulates graphics card) |
Dedicated interfaces PCIe_BMC IPMB (via MMC) (opt.) |
PCI Express | 32 PCIe Gen4 lanes, 16 PCIe Gen3 lanes | 48 PCI Express Lanes 2x PCI Express x16 Gen4 (x16, x8, x4) 2x PCI Express x8 Gen3 (x8, x4, x2) |
USB | 4x USB 3.0/2.0 | 4x USB 3.0/2.0 |
Serial ATA | TBC | TBC |
TPM | Yes (TPM 2.0) | Yes (TPM 2.0) |
Management Bus | 2x I2C, SMBus | 2x I2C, SMBus |
Embedded Features | SEMA, Debug | EAPI/SEMA, Debug/JTAG |
Power Supply | 12 V / 5Vsb ±5% (ATX) 12V ±5% (AT) |
12 V / 5Vsb ±5% (ATX) 12V ±5% (AT) |
Operating Temperature |
Standard: 0°C to +60°C | Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C (selected SKUs) |
OS Support | Windows 10 IoT Enterprise LTSC, Windows Server 20H1 Yocto project based Linux 64-bit, VxWorks (TBC) | Windows 10 IOT Enterprise LTSC 64-bit, Windows Server 20H1 64-bit Yocto Linux 64-bit, Ubuntu 64-bit (TBC) VxWorks 64-bit (TBC) |
Form Factor | PICMG COM-HPC: Rev 1.0 Server Type Size E: 200 x 160 mm |
PICMG COM-HPC: Rev 1.0 Server Type Size E: 200 x 160 mm |
COM-HPC-cRLS | |
CPU | 13th Gen Intel Core: i7-13700E 13th Gen Intel Core i5-13500E 13th Gen Intel Core i3-13100E |
Memory | Up to 128GB DDR5 SO-DIMM at max.4000 MT/s |
BIOS | AMI UEFI with CMOS backup in 32MB SPI BIOS |
Graphics Outputs | eDP 1.4b (or MIPI-DSI) 3x DDI (DP/HDMI/DVI) DP1.4a 4 independent displays HDMI2.0b |
Audio | Intel HD Audio integrated on CPU |
Camera | – |
LAN | Intel i226 Series 2.5GbE (TSN @ IT) |
USB | 4x USB 3.2 4x USB 2.0 |
Serial | 2x UART |
PCI Express | 1x PCIe Gen5 x16 at 16-31 and 1x PCIe Gen4 x4 at 8-11 6x PCIe Gen3 x1 at 0-5 (x4, x2, x1) More lanes with R680E/Q670E (all x4, x2, x1): – 1x PCIe Gen4 x4 at 12-15 – 1x PCIe Gen4 x4 at 32-35 – 1x PCIe Gen4 x4 at 36-39 |
TPM | Optional TPM 2.0 |
Management Bus | 2x I2C, SMBus, 1x GP SPI, 1x Boot SPI and eSPI |
Embedded Features | SEMA Debug/DB40-HPC |
Power Supply | 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT) |
Operating Temperature | Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C (standard 12V input only) |
OS Support | Windows 10 IoT Enterprise LTSC, Yocto Linux 64-bit |
Form Factor | PICMG COM-HPC: Rev 1.1 Client Type size C: 160 x 120 mm |