WAFER-TGL-U3.5" SBC with Intel Tiger Lake-UP3 and four independent displays
- Manufacturer
- Configurations
- 3 available configurations
The IEI WAFER-TGL-U is a 3.5" Small Form Factor SBC based on Intel Tiger Lake-UP3. It supports four independent displays through HDMI and DisplayPort outputs plus an iDPM slot for eDP/LVDS/VGA modules, and provides three 2.5 GbE ports. Memory is handled by a DDR4 SO-DIMM socket up to 32 GB, while M.2 A key and B key slots allow 4G/LTE and 5G connectivity. The board offers USB 3.2 Gen 2 at 10Gb/s, +12V DC power input and an operating range of 0~60 °C.
At a glance
- iDPM slot for eDP/LVDS/VGA modules
- DDR4 SO-DIMM up to 32 GB
- M.2 A key and B key
- USB 3.2 Gen 2 at 10Gb/s
Technical specifications
| Processor | 11th Gen. Intel® mobile Tiger Lake-UP3 on board · Intel® Tiger Lake-UP3 Core I™ Celeron® ProccessorIntel® Celeron® 6305E (up to 1.8GHz(optional)Intel® Core™ i3-1115G4E (up to 3.9GHz(optional)Intel® Core™ i5-1145G7E (up to 4.1GHz(optional)Intel® Core™ i7-1185G7E (up to 4.4GHz(optional) |
|---|---|
| Graphics | Intel® Gen11 UHD Graphics for Core™ i3-1115G4E and Celeron® 6305E · Iris® Xe Graphics for i5-1145G7E and i7-1185G7E |
| Security & watchdog | Intel® PTT(TPM 2.0) |
| Memory | One 260-pin 3200 MHz DDR4 SO-DIMMs support up to 32 GB |
|---|
| SATA ports | 1× SATA : 6Gb/s with 5V SATA power connector |
|---|
| Video outputs | 1× iDPM : IEI iDPM 3040× slot (only for IEI eDP/LVDS/VGA module)1 x Display Port : up to 4096 x 2160@60Hz2 x HDMI : up to 4096 x 2160@30Hz |
|---|
| Digital I/O | 1× DIO : 12-bit digital I/O (2x7 pin, P=2.0) |
|---|---|
| Other I/O | 1× I²C (1x4 pin) |
| Audio | 1× HD Audio : 1× iAUDIO, support IEI AC-KIT-888S Audio Module (2× 5 pin) |
| Ethernet ports | LAN1: Intel® I225V 2.5GbE controllerLAN2: Intel® I225V 2.5GbE controllerLAN3: Intel® I225V 2.5GbE controller |
| Serial interfaces | 1× Internal RS-232 : 2x5 pin, P=2.02 x Internal RS-232/422/485 : 2x5 pin, P=2.00 ,RS-485 support AFC |
| USB ports | 2× Internal USB 2.0 : 2x4 pin, P=2.004 x External USB 3.2 Gen2x1 : 10Gb/s |
| Wireless | 4G/LTE5G |
|---|
| Form factor | 3.5" SBC |
|---|
| Supply voltage | +12V DC input power (AT/ATX mode) |
|---|
| Dimensions | 146mm x 102mm |
|---|---|
| Weight | 0.35–0.85 kg |
| Operating temperature | -10–60 °C0–60 °C0–45 °C(optional) |
|---|
| Certifications | CEFCC |
|---|
| Ordering variants | 1× QIG |
|---|
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Family configurations
The order codes of this family: the sheet applies to all of them, the detail of each configuration is in the datasheet.
| Configuration (PN) |
|---|
| WAFER-TGL-U-CE-R12 |
| WAFER-TGL-U-i3-R12 |
| WAFER-TGL-U-i7-R12 |
Documentation
In the same family
More products from the same series: select up to 3 and compare them side by side.
In the same category
Let's talk about your project
Phone and email go straight to our technical sales team in Turin: the first answer is already a technical one.