Scheda ADLINK Express-CFE con slot di memoria, chipset e connettori a bordo scheda

Computer-on-Module (COM)

EXPRESS-CFECOM Express Type 6 Basic Computer-on-Module with 8th Gen Intel Xeon and Core

Manufacturer

EXPRESS-CFE is a PICMG COM.0 R3.0 Type 6 CPU module in the Basic 125 mm x 95 mm form factor: the computing logic sits on the module, the application I/O on the carrier — for example Express-BASE6, which hosts the audio codec (ALC886 standard supported).

The distinctive axis is the pairing of the Xeon E-2176M with the CM246 chipset, which enables ECC and non-ECC memory across three DDR4 SODIMM sockets at 2133/2400 MT/s. The PCIe Gen3 link can be split as x16, 2× x8 or 1× x8 with 2× x4, and the PCIe ports support NVMe and Intel Optane Memory Technology.

Available with Xeon E-2176M (Express-CFE-E-2176M, CM246) or with Core i7-8850H, Core i5-8400H and Core i3-8100H.

At a glance

  • Wide input 8.5–20 V
  • Integrated Smart Embedded Management Agent (SEMA)
  • Intel AMT 12.0 with I219LM Ethernet
  • Optional Infineon TPM 2.0
  • Shock per IEC 60068-2-27

Technical specifications

CPU generation8th gen (Coffee Lake)
ProcessorCore i3-8100H(optional)Xeon E-2176M(optional)Core i5-8400H(optional)Core i7-8850H(optional)
TPMTPM 2.0

MemorySODIMM DDR4 2133/2400 MT/s
Maximum RAM48 GB
RAM typeDDR4(optional)

Storage4× ports SATA 6Gb/s (SATA0,1,2,3)

Video outputsIntel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs

Ethernet portsIntel® I219LM/V with AMT 12.0 support (only LM version support AMT)10/100/1000× GbE connection
Serial interfaces2× UART ports with console redirection
Digital I/O4 GPO and 4 GPI (GPI with interrupt) · SD/GPIO muxed design, switched by BIOS setting
Other I/OSMBus and I2CGbE, 4× SATA 6 Gb/s, 4× USB 3.1 and 4× USB 2.0
Audiolocated on carrier Express-BASE6 (ALC886 standard supported) · Intel® HD Audio integrated in chipset
USB ports4× USB 3.1 (USB 0, 1, 2, 3) and 4× USB 2.0 (USB 4, 5, 6, 7)

Architecture standardCOM Express Type 6
Board functionCPU module
Form factorBasic

ExpansionPCIe x16, 2× PCIe x8, or 1× PCIe x8 with 2× PCIe x4 (Gen3)6× PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5

Power input8.5–20 V

DimensionsBasic size: 125 mm x 95 mm

Operating temperature0–60 °C
Storage temperature-20–80 °C

Operating systemsWindowsLinux

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

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