Scheda COM ADLINK CEXPRESS-BW con chip centrale, slot di espansione e connettori sui bordi

Computer-on-Module (COM)

CEXPRESS-BWCOM Express Type 6 Compact Computer-on-Module with Intel Braswell SoC

Manufacturer

The module acts as the CPU in carrier board architectures: connectors and application logic sit on the carrier, while cExpress-BW provides the SoC, memory and the interfaces defined by PICMG COM.0 Rev 2.1.

The build options make the difference: single/dual channel 18/24-bit LVDS in place of eDP, 8/16/32 GB onboard SSD in place of the SATA1 port, five PCIe x1 with bridge in place of the three native ones. Power accepts the standard 12 V input or the 5-20 V wide input, in ATX or AT mode.

Available configurations: cExpress-BW-N3710 (Pentium N3710), cExpress-BW-N3160, cExpress-BW-N3060 and cExpress-BW-N3010 (Celeron), cExpress-BW-x5-E8000 (Atom x5-E8000).

At a glance

  • Dual or quad-core Intel Braswell SoC
  • Up to 8 GB dual channel DDR3L
  • Three independent, simultaneous displays
  • Integrated Smart Embedded Management Agent (SEMA)
  • TPM 1.2 onboard

Technical specifications

CPU generationBraswell
ProcessorDual · Intel Atom x5 E8000, Pentium N3710 and Celeron N3160/N3060/N3010 Series System-on-Chip (codename: Braswell)Intel® Atom™ X5-E8000(optional)Intel® Celeron® N3010(optional)Intel® Celeron® N3060(optional)Intel® Celeron® N3160(optional)Intel® Pentium® N3710(optional)
TPMTPM 1.2

MemoryDDR3L 1600 MT/s
Maximum RAM8 GB
RAM typeDDR3L

StorageOptional onboard SSD (8/16/32GB) in place of SATA1 port

Video outputsThree DDI channels, 1× eDP, (shared with DDI3) 3 independent · DDI3 supporting DisplayPort/HDMI (shared with LVDS/eDP)DDI1 supporting DisplayPort/HDMILVDS is optionally available to support next generation displaysSingle/dual channel 18/24-bit LVDS (build option in place of eDP)

Ethernet portsIntel® Ethernet Controller i211AT10/100/1000× GbE connection
Digital I/O4 GPO and 4 GPI · SD muxed with GPIO, switched by BIOS setting
AudioOn Express-BASE6 carrier (ALC886 standard support) · Intel® HD Audio integrated in SoC
USB portsUSB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7, port 4-7 from USB hub)

Architecture standardCOM Express Type 6
Board functionCPU module
Form factorCompact

Expansion3× PCIe x1: Lanes 0/1/2 (build option 5× PCIe x1 with bridge)

Supply voltageATX: 12V±5%/5Vsb ±5%, or AT: 12V±5% · ATX: 5-20 V/5Vsb ±5%, or AT: 5-20V

DimensionsCompact size: 95 mm x 95 mm

Operating temperature0–60 °C

Operating systemsLinuxVxWorksWindows

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

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