EXPRESS-RLPCOM Express Type 6 Basic Computer-on-Module with 13th Gen Intel Core Raptor Lake-P
- Manufacturer
- Configurations
- 1 available configurations
Express-RLP is the COM Express Type 6 CPU module in Basic form factor (125 mm x 95 mm) built on the Intel Raptor Lake-P platform: processor, memory and BIOS sit on the module, the application I/O on your carrier.
Two axes set it apart: the hybrid P-core/E-core architecture rated at 15W/28W/45W TDP, which lets you choose the thermal budget while staying on the same pinout, and HALT qualification covering thermal stress, vibration stress, thermal shock and combined testing. The memory supports IBECC on selected SKUs, while the PCIe x8 Gen4 lanes (lanes 16-23) are available on the 45W SKUs (35W cTDP).
The Express-RLP-U300E configuration is listed in the family.
At a glance
- Up to 14 cores, 20 threads
- 2.5GbE Intel I226, TSN build option
- Wide 8.5–20 V input
- On-board TPM 2.0
- Four concurrent displays from integrated graphics
Technical specifications
| CPU generation | 13th gen (Raptor Lake) |
|---|---|
| Processor | Core™ i7-13800HRE(optional)Core™ i3-13300HRE(optional)Core™ i5-13600HRE(optional)Core™ i7-13800HE(optional)Core™ i5-13600HE(optional)Core™ i3-13300HE(optional) |
| TPM | TPM 2.0 |
| CPU cores | 14 |
| Memory | 2× SODIMM DDR5 5200 MT/s |
|---|---|
| Maximum RAM | 64 GB(optional) |
| RAM type | DDR5(optional) |
| Storage | 2× SATA 6Gb/s (SATA 0-1)NVMe SSD in place of PCIe lanes 28-31 (build option, project basis) |
|---|
| Video outputs | 4 displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4 (TBC) · DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVI |
|---|
| Ethernet ports | 2.5GbE and 1000/100/10 Mbit/s Ethernet connection · GbE0_SDP if TSN support enabled (TBC) |
|---|---|
| Serial interfaces | 2× UART ports with console redirection |
| Digital I/O | 8× GPIO (GPI with interrupt) |
| USB ports | Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC) |
| Architecture standard | COM Express Type 6 |
|---|---|
| Board function | CPU module |
| Form factor | Basic |
| Expansion | PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs) PCIe x4 Gen4, lanes 24-27 PCIe x4 Gen4, lanes 28-318× PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4× PCIe x1 Gen3: Lanes 4/5/6/7 |
|---|
| Power input | 8.5–20 V |
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| Dimensions | Basic size: 125 mm x 95 mm |
|---|---|
| Rugged / conformal coating | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test · Extreme Rugged operating temperature (selected SKUs) |
| Operating temperature | 0–60 °C-40–85 °C(optional) |
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| Operating systems | Windows 10 IoTWindows 11 IoTLinuxVxWorks |
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Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Family configurations
The order codes of this family: the sheet applies to all of them, the detail of each configuration is in the datasheet.
| Configuration (PN) |
|---|
| EXPRESS-RLP-U300E |
Documentation
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