Pannello posteriore ADLINK DLAP-3000 con porte COM, DP, LAN, USB e connettore DC-IN

Embedded Computers

DLAP-3000ADLINK edge AI computer with Intel CPU and DDR4 ECC memory

Manufacturer

DLAP-3000 is an x86 class ADLINK edge AI platform: it collects and analyzes production data in the plant, where Windows or Linux applications are needed alongside inference workloads.

The processor is chosen when ordering, between Intel Celeron or Pentium and 8th or 9th generation Intel Core i3, i5 or i7, on an H310 or Q370 chipset. The declared operating systems are Linux and Windows 10 IoT.

At a glance

  • CPU generation: 8th gen (Coffee Lake)
  • Processor: 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • RAM type: DDR4
  • Maximum RAM: 64 GB
  • ECC support: No

Technical specifications

CPU generation8th gen (Coffee Lake)9th gen (Coffee Lake-R)
Processor8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
ChipsetH310Q370
GraphicsInfo onlyADLINK MXM Graphics module support (Type A/B, up to 120W)

RAM typeDDR4
Maximum RAM64 GB
ECC supportNo

Storage2× 2.5" SATA III, external bays(SATA 6Gb/s)

Video outputs6× DisplayPort (2 da CPU, 4 da MXM)4096x2304@60Hz(DisplayPort)

Ethernet ports1× GbE (Intel® i219-LM)
USB ports4× USB 2.04× USB 3.2 Gen1 x1
Serial interfaces1× RS-2321× RS-232/422/485
AudioOption 2: Mic-in, L/R speaker-out (6W + 6W)(optional)Option 3: Line-in, L/R speaker-out (6W + 6W)(optional)
Digital I/ODefault: w/o DIO; Optional: 1x DI/DO with 4 in, 4 out
Other I/OPush to reset the system.

Wireless4G/LTE

AC/DC inputDC
Supply voltage1.5–5 V

MountingWall Mount(optional)
Dimensions235 × 75 × 182 mm

Operating temperature0–50 °C
Storage temperature-20–70 °C

CertificationsCEFCCUL

Operating systemsLinuxWindows 10 IoT

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

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