
BCO-3000-RPLWall-mount embedded computer with three 2.5GbE LAN and optional Hailo-8 AI module
- Configurations
- 1 available configurations
BCO-3000-RPL is an embedded computer for wall mounting (DIN rail optional): extruded aluminum chassis of 192 × 69 × 240 mm, operation from 0 to 50 °C, MIL-STD-810G shock and vibration testing and CE, FCC, UL and UKCA certifications.
It accepts 35 W 12th/13th generation Intel Core processors on a Q670E chipset, with DDR4 up to 64 GB and an NVMe SSD on M.2; three 2.5GbE LAN, six USB 3.2 Gen 2, four serial ports on DB9, isolated 8 in / 8 out DIO, three 4K video outputs, an M.2 slot for Wi-Fi 6E and 5G/4G modules, the optional Hailo-8 and a 120 W power supply complete the unit. The BCO-3000-RPL-Barebone version belongs to the family.
At a glance
- CPU generation: 13th gen (Raptor Lake)
- CPU TDP: 35 W
- Memory: DDR4 SO-DIMM 3200 MT/s
- RAM type: DDR4
- Maximum RAM: 64 GB
Technical specifications
| CPU generation | 13th gen (Raptor Lake)12th gen (Alder Lake) |
|---|---|
| Processor | 12th/13th Gen Intel® Core™ Processor i9/i7/i5/i3, Pentium, Celeron (35W only)(optional) |
| Chipset | Q670E |
| Graphics | Intel® UHD Graphics |
| AI module | Hailo-8(optional) |
| CPU TDP | 35 W |
| Memory | DDR4 SO-DIMM 3200 MT/s2× SO-DIMM DDR4 3200 MT/s (default 8 GB) |
|---|---|
| RAM type | DDR4 |
| Maximum RAM | 64 GB |
| Storage | 1× M.2 M-Key (2242/2280), SSD NVMe PCIe x4 Gen 3256GB M.2 (opzione ordering)(optional)512GB M.2 (opzione ordering)(optional)Support 1x PCIe x1, 1x USB 3.2 Gen 2, 1x USB 2.0, 5G/4G/LTE Module(M.2)1× SSD NVMe PCIe x4 Gen 3 da PCH (default 128 GB)(SSD/HDD)1TB M.2 (opzione ordering)(optional)128GB M.2 (opzione ordering)(optional)2TB M.2 (opzione ordering)(optional) |
|---|
| Number of displays | 3 |
|---|---|
| Video outputs | 2× DisplayPort2× DisplayPort 1.4a Dual-Mode (max 4096×2304 @60Hz)(4096x2304)1× HDMI 1.4b (max 4096×2304 @24Hz)(4096x2304) |
| Ethernet ports | 3× LAN3× 2.5GbE (RJ45)Intel® I226V PCIe 2.5GbE LAN |
|---|---|
| USB ports | 6× USB 3.2 Gen 22× USB 3.2 Gen 12× USB 2.0 (Type-A) |
| Serial interfaces | 2× COM4× DB9 |
| Audio | Realtek ALC897Line-out/Mic-in |
| Digital I/O | 16 canali DIO (8× DI + 8× DO), isolate(in)16 canali DIO (8× DI + 8× DO), isolate(out) |
| Other I/O | 5x Antenna Holes, 1x Power button, 1x HD LED, 1x Power LED |
| Wireless | 4G/LTE5GWi-FiBluetooth |
|---|
| Expansion | 1x M.2 E-key (2230) Support 1x PCIe x1, 1x USB 2.0; Support CNVi Devices Supported: Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro1× M.2 B-Key (3042, PCIe x1 + USB 3.2 Gen 2 x1 + USB 2.0), Nano SIM, modulo 5G/4G/LTE1x M.2 E key Type: 2230 (Support PCIe x1 + USB 2.01× M.2 B-Key (3042)(WWAN)M.2 B-Key per modulo 5G/4G/LTE, opzionale(optional)1× M.2 B-Key (3042, 1× PCIe x1 + 1× USB 3.2 Gen 2 + 1× USB 2.0), 1× Nano SIM, modulo 5G/4G/LTE opzionale(optional · WWAN) |
|---|
| AC/DC input | DC |
|---|---|
| Power input | 9–36 V |
| Mounting | Wall MountDIN Rail Mount(optional) |
|---|---|
| Dimensions | 192 × 69 × 240 mm |
| Chassis material | alluminio, metallo(extruded) |
| Operating temperature | 0–50 °C |
|---|---|
| Storage temperature | -30–85 °C |
| Certifications | ULUKCAFCCCE |
|---|
| Operating systems | LinuxWindows |
|---|
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Family configurations
The order codes of this family: the sheet applies to all of them, the detail of each configuration is in the datasheet.
| Configuration (PN) |
|---|
| BCO-3000-RPL-Barebone |
Documentation
In the same family
More products from the same series: select up to 3 and compare them side by side.
In the same category

Let's talk about your project
Phone and email go straight to our technical sales team in Turin: the first answer is already a technical one.













