June 2022

WAFER-TGL-U: 3.5″ SBC with 11th generation Intel Core SoC Tiger Lake

C&T Solutions introduces WAFER-TGL-U, the 3.5-inch Single Board Computer with an excellent price/performance balance based on 11th Generation Intel Core SoC with Tiger Lake architecture, ensuring a sharp performance increase over previous generation platforms. WAFER-TGL-U embedded board allows for the integration of up to 32GB of SO-DIMM DDR4 memory with a maximum frequency of 3200 MHz and offers rich I/O such as 1x DP 1.4 and 2x HDMI 1.4 with the ability to drive 3 independent displays, 3x RJ45 2.5GbE and 4x USB 3.2 Gen 2. Further expansion is possible with M.2 functional modules, including 1x M.2 2230 A-key and 1 x M.2 3042/2280 B-key with USIM socket. WAFER-TGL-U offers the possibility of optionally equip an active or passive heatsink module, optimally managing heat dissipation under all operating conditions. Its 12V DC voltage input, operation from 0°C to +60°C, and compact, easy-to-integrate design ensure maximum reliability and very low maintenance in all kinds of industrial applications.