July 2021

GO-B02/B03: Modular servers for edge computing with 3rd generation Intel Xeon CPUs.

GOMA Elettronica SpA introduces GO-B02 and GO-B03, the new modular edge computing servers based on 3rd generation Intel Xeon Scalable architecture designed for machine vision, inference, AI and on-board high performance computing industrial applications. The rugged and versatile design provides a variety of mounting and deployment options. It is supplied with angle mounting brackets for ease of mounting both on machine and control racks walls. By removing the mounting brackets, the units can be used for horizontal installations in small spaces. The small overall dimensions, the front position of all I/O ports and power supply input offer an optimal cable access. GO-B02 and GO-B03 feature a 3rd generation Intel Xeon Scalable single processor platform, that can be equipped with an up to 2TB ECCR memory and a M.2 NVMe storage support.
GO-B02 offers an extremely compact chassis with a width of only 88mm suitable for the installation of low-profile cards. GO-B03, instead, features a width of 125mm to host full-height cards. Both solutions have up to four PCI Express slots for the installation of network cards, PoE framegrabbers, FPGAs, GPUs and communication cards.