EGX-MXM-BW5000 — Mezzanine Modules

Mezzanine Modules

EGX-MXM-BW5000MXM Type B graphics module with NVIDIA RTX PRO 5000 Blackwell

Manufacturer

EGX-MXM-BW5000 is the ADLINK graphics mezzanine module in standard MXM 3.1 Type B form factor, designed to bring graphics and GPGPU acceleration into embedded systems already in design: edge AI, machine vision, medical imaging and gaming, where the workload is updated by changing the module, not the platform.

The distinctive axis is compute density: 10,496 CUDA cores, 328 Tensor Cores and 80 RT Cores on NVIDIA Blackwell architecture, for 49.8 TFLOPS FP32 peak. Module power consumption is 115 W, with a 95–150 W option, so you can align the GPU with the chassis thermal budget; for cooling, the Type B solutions THSF-MXMB-BW (active cooler) and THSP-MXMB-BW (heat spreader) are available.

At a glance

  • PCIe Gen4/5 x16 interface
  • Extended temperature −40~85 °C
  • Footprint 82 x 105 x 4.8 mm
  • Windows and Linux 64-bit drivers

Technical specifications

GraphicsNVIDIA RTX PRO 5000 Blackwell

Memory24GB GDDR7

Architecture standardMXM
Board functionGPU / Graphics
Bus interfacePCIeGen 5 up to x16 interface · PCIeGen4/5 x16

Dimensions82 (W) x 105 (D) x 4.8 (H) mm

Operating temperature-40–85 °C

Operating systemsWindowsLinux

Form factorMXM Type B

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

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