COM-HPC-SIDH — Computer-on-Module (COM)

Computer-on-Module (COM)

COM-HPC-SIDHCOM-HPC Server CPU module with Intel® Xeon® D-2700 and DDR4 RDIMM

Manufacturer

COM-HPC-sIDH is a module compliant with PICMG COM-HPC Rev 1.0 Server Type in Size D format, 160 mm x 160 mm: the system logic sits on the module, the physical I/O on the carrier you design. It is used where server-class compute power is needed in an embedded footprint, from edge servers to network equipment with a BMC on the carrier.

The expansion plan counts 48 PCIe lanes, 32 Gen4 and 16 Gen3, with lanes 0-15 together with USB 3.0, SATA and NBASE-T derived from HSIO. For remote management the module exposes a PCIe dedicated to the carrier BMC and, as a build option, IPMB; the AVX-512 VNNI extension remains available on the Xeon D SoC.

Available configurations: COM-HPC-sIDH-D-2896TER, COM-HPC-sIDH-D-2796TE, COM-HPC-sIDH-D-2775TE and COM-HPC-sIDH-D-2752TER, each with its respective Intel Xeon D.

At a glance

  • Up to 512 GB DDR4
  • Up to 8× 10GBASE-KR, depending on SoC SKU
  • Optional Extreme Rugged −40~85 °C
  • TPM 2.0 on SPI interface

Technical specifications

ProcessorNew Gen Intel® Xeon® D-2700 (formerly "Ice Lake-D HCC")
TPMTPM 2.0

Memory4× RDIMM DDR4 3200 MT/s
Maximum RAM512 GB
RAM typeDDR4

Storage2× SATA (SATA 0, 1), build option in place of PCIe_BMC (TBC)

Ethernet portsUp to 8× 10G-KR · Up to 8× 10GBASE-KR (dependent on SoC SKU) · Intel® Ethernet Connection I225 Series
Serial interfaces2× UART ports with console redirection
Digital I/O12× GPIO (GPI with interrupt, TBC)
USB ports4× USB 3.0/2.0/1.1 (USB 0,1,2,3)

Architecture standardCOM-HPC Server
Board functionCPU module

Expansion32× PCIe Gen4, 16× PCIe Gen3 lanes

Power inputAT: 12V±5%

DimensionsSize D: 160 mm x 160 mm

Operating temperature0–60 °C-40–85 °C(optional)

Operating systemsVxWorksWindowsWindows 10 IoTLinux

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

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