
MicroTCA Blades & Modules (MTCA.0)
AMC518AMC FPGA carrier with Xilinx Zynq-7000 and built-in CPU
AMC518 is a carrier for FMC boards built around a Xilinx Zynq-7000 device: the CPU is included in the FPGA package, so board handling and firmware loading call for no separate processor.
Onboard there are two banks of DDR3, at 64 bits for the FPGA and at 32 bits for the CPU, while towards the backplane the module exposes dual 10 GbE and dual 1000-BaseBX Gigabit. The carrier draws about 10 W without a mezzanine and storage temperature runs from -40 to 85 °C.
At a glance
- FPGA / processing: SoC CPU included in FPGA package
- Board function: FPGA
- Architecture standard: AMC.1
- Form factor: Single full-size
- Power consumption: 10 W
Technical specifications
| FPGA / processing | SoC CPU included in FPGA packageXilinx FPGA Zynq-7000 Device |
|---|
| Ethernet ports | Dual 10GbE and Dual 1000-BaseBX from Zynq FPGA |
|---|
| Board function | FPGA |
|---|---|
| Architecture standard | AMC.1AMC.2AMC.4AMC |
| Form factor | Single full-size |
| Bus interface | Front Panel FMC; 2x Micro USB for MGT RS-232 and CPU RS-232Dual x4 via FPGA to AMC |
| IPMI management | 2.0 |
| Hot-swap | sì(psu)sì(ejector-handle) |
| Power consumption | 10 W |
|---|
| Dimensions | 73.5 × 180.6 mm |
|---|
| Storage temperature | -40–85 °C |
|---|
| Certifications | CEULFCC |
|---|
| Operating systems | WindowsVxWorksLinux |
|---|
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Documentation
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