VT878Conduction-cooled MicroTCA chassis
- Manufacturer
In conduction cooling the heat of the modules is not carried away by an air flow but discharged onto the structure of the chassis: it is the obligatory choice where dust, humidity or noise rule out the use of fans.
VT878 applies this principle in a complete MicroTCA system, with a lightweight enclosure that also allows use on mobile platforms. The declared profiles towards the modules are AMC.0, AMC.1, AMC.2 and AMC.4, with CE, FCC and UL certifications and a storage range from -40 to 90 °C.
At a glance
- Architecture standard: AMC
- Cooling: Conduction-cooled
Technical specifications
| Architecture standard | AMCAMC.1AMC.2AMC.4 |
|---|---|
| AMC slot configuration | Backplane |
| Weight | 2 kg |
|---|
| Storage temperature | -40–90 °C |
|---|---|
| Cooling | Conduction-cooled |
| Certifications | FCCULCE |
|---|
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Documentation
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