TXMC897XMC mezzanine module in two operating temperature windows
- Manufacturer
- Configurations
- 2 available configurations
TXMC897 is a mezzanine module in XMC form factor (VITA 42/61). It plugs into the XMC site of a carrier board, which supplies power and the data link, and brings the interface towards the field without taking a slot of the rack.
The axis that separates the versions is thermal: the module is declared in two alternative windows, -40~85 °C or 0~55 °C, and the choice follows the installation environment.
The family is also available in 2 or 4 channel versions, with weight differences between the configurations; an ordering example is TXMC897-10R.
At a glance
- Channels: 4 channel
- Architecture standard: XMC VITA 42/61
- Board function: Ethernet
- Cooling: Air-cooled (VITA class)
- Operating temperature: -40–85 °C
Technical specifications
| Connectors | RJ45SFP |
|---|
| Channels | 4 channel |
|---|
| Architecture standard | XMC VITA 42/61 |
|---|---|
| Board function | Ethernet |
| Bus interface | x8/x4 PCI Express (Specification 3.0) compliant interface conforming to ANSI/VITA 42.3 |
| Weight | 0.101 kg |
|---|
| Cooling | Air-cooled (VITA class) |
|---|---|
| Operating temperature | -40–85 °C0–55 °C |
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Family configurations
Columns show only what changes between configurations: the rest of the sheet applies to the whole family.
| Configuration (PN) | Weight(kg) | MTBF(h) |
|---|---|---|
| TXMC897-10R | 0.101 | 404000 |
| TXMC897-20R | 0.11 | 293000 |
Documentation
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