TXMC59016-channel XMC analog/digital I/O mezzanine module
- Manufacturer
- Configurations
- 1 available configurations
TXMC590 is a mezzanine module in XMC form factor (VITA 42/61) for analog/digital I/O. The XMC connector of the carrier board carries power and data; the field signals go instead through an MDR connector on the module.
Cooling is by air and the declared temperature is -40~85 °C both in operation and in storage: the module imposes no warehouse conditions different from the plant ones.
The versions of the family are identified by the ordering suffix, for instance TXMC590-10R.
At a glance
- Serial interfaces: one interrupt
- Channels: 16 channel
- Architecture standard: XMC VITA 42/61
- Board function: Analog and digital I/O
- Cooling: Air-cooled (VITA class)
Technical specifications
| Connectors | MDR |
|---|---|
| Serial interfaces | one interrupt |
| Channels | 16 channel |
|---|
| Architecture standard | XMC VITA 42/61 |
|---|---|
| Board function | Analog and digital I/O |
| Bus interface | PCI Express (Base Specification 2.1) up to x4 compliant interface conforming to ANSI/VITA 42.3-2006 (R2014) (XMC PCI Express Protocol Layer Standard) |
| Weight | 0.08 kg |
|---|
| Cooling | Air-cooled (VITA class) |
|---|---|
| Operating temperature | -40–85 °C−40~85(optional) |
| Storage temperature | -40–85 °C |
| MTBF | 464000 h(GB · MIL-HDBK-217F Notice 2) |
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Family configurations
The order codes of this family: the sheet applies to all of them, the detail of each configuration is in the datasheet.
| Configuration (PN) |
|---|
| TXMC590-10R |
Documentation
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