TXMC639 Reconfigurable FPGA with 16x Analog Input 8x Analog Output and 32x Digital I/O

Mezzanine Modules

TXMC639XMC mezzanine module with a choice of FPGA and analog/digital I/O

Manufacturer

TXMC639 is a mezzanine module in XMC form factor (VITA 42/61) with an FPGA and analog/digital I/O. The acquisition and signal processing logic is configured in the FPGA, so the behavior of the module suits the application without changing hardware.

Cooling is by air and the declared operating temperature is -40~85 °C, a condition compatible with industrial installations without climate control.

The configurations of the family differ in number of channels — 4, 8, 16, 32 or 64 — and in the fitted FPGA, XC7K160T-2FBG676I or XC7K325T-2FBG676I; an ordering example is TXMC639-10R.

At a glance

  • Processor: XC7K160T-2FBG676I (AMD)
  • Architecture standard: XMC VITA 42/61
  • Board function: FPGA
  • Cooling: Air-cooled (VITA class)
  • Operating temperature: -40–85 °C

Technical specifications

ProcessorXC7K160T-2FBG676I (AMD)

ConnectorsMezzanine P14/P15/P16N-pin connector(male)

Architecture standardXMC VITA 42/61
Board functionFPGAAnalog and digital I/O
Bus interfacePCI Express x4 Link (Base Specification 2.1) compliant interface

Weight0.14 kg

CoolingAir-cooled (VITA class)
Operating temperature-40–85 °C

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

Family configurations

Columns show only what changes between configurations: the rest of the sheet applies to the whole family.

Configuration (PN)FPGA / processingProcessorPower consumption(W)
TXMC639-10RAMD XC7K160T-2FBG676I Kintex 7XC7K160T-2FBG676I (AMD)12.513.2
TXMC639-11RAMD XC7K325T-2FBG676I Kintex 7XC7K325T-2FBG676I (AMD)16.515.6
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