TXMC3764-channel XMC serial mezzanine module, conduction-cooled
- Manufacturer
- Configurations
- 2 available configurations
TXMC376 is a mezzanine module in XMC form factor (VITA 42/61) for serial communication. It plugs into the XMC site of a carrier board and extends its I/O towards instruments and units connected to the system.
The axis that characterizes it is environmental: conduction cooling and a declared operating temperature of -40~85 °C, a condition suited to closed cabinets and mobile vehicles.
The versions of the family are identified by the ordering suffix, for instance TXMC376-10R.
At a glance
- Channels: 4 channel
- Architecture standard: XMC VITA 42/61
- Board function: Serial
- Power consumption: 0.23–1.29 W
- Cooling: Conduction-cooled
Technical specifications
| Connectors | Mezzanine P14/P15/P16 |
|---|---|
| Serial interfaces | 584SR/232SR(MAX3161E)Software selectable RS232, RS422, RS485 full duplex, RS485 half duplex(full/half · MAX3161E) |
| Channels | 4 channel |
|---|---|
| I/O protection | ESD(HBM) |
| Architecture standard | XMC VITA 42/61 |
|---|---|
| Board function | Serial |
| Power consumption | 0.23–1.29 W |
|---|
| Weight | 0.062 kg |
|---|
| Cooling | Conduction-cooled |
|---|---|
| Operating temperature | -40–85 °C |
| MTBF | 1508000 h(GB · MIL-HDBK-217F Notice 2) |
Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Family configurations
The order codes of this family: the sheet applies to all of them, the detail of each configuration is in the datasheet.
| Configuration (PN) |
|---|
| TXMC376-10R |
| TXMC376-20R |
Documentation
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