TPCE646-10R — PCI & PCIe I/O Boards

PCI & PCIe I/O Boards

TPCE646-10RPCI Express card with AMD Zynq UltraScale+ MPSoC FPGA and analog I/O

Manufacturer

PCI Express add-in card, standard height, half-length (98 mm x 154 mm), compliant with PCI Express CEM R3.0, for measurement and control chains where processing takes place on the board and not in the host: user code runs in the MPSoC, in direct contact with the converters.

The MPSoC works with 4 GB of 64-bit DDR4 SDRAM on each of the PL and PS interfaces. On the rear I/O, 64 direct MPSoC lines can be configured as 64 single ended LVCMOS18 or as 32 differential LVDS interfaces, while two groups of four GTY lines reach 25 Gbps; the JTAG header opens in-circuit debugging of PL and PS.

Driver support is available for VxWorks (TPCE646-SW-42), Windows (TPCE646-SW-65), Linux (TPCE646-SW-82) and QNX (TPCE646-SW-95).

At a glance

  • Sampling up to 5 Msps per channel
  • Simultaneous conversion on all D/A outputs
  • Output range configurable per channel
  • Ethernet RJ45 10/100/1000 Mbps on rear I/O
  • Optional PCI Express x4 Gen2 link to PS

Technical specifications

ProcessorAMD Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I

Memory4 GB of 64 bit DDR4 SDRAM for both the PL and PS memory interfaces

Digital I/O4 differential digital LVDS I/O linesfour differential LVDS I/O lanes on the front I/O interface64 MPSoC I/Os on a rear I/O connector (directly connected)can be configured as 64 single ended LVCMOS18 or as 32 differential LVDS interfaces
Connectors2× 38 pin Firefly Micro Flyover Connector (UEC5-019-1-H-D-RA-2-A) (Samtec)
Ethernet ports10/100/1000 Mbps RJ45 Ethernet Interface
Other I/OJTAG provides in-circuit PL and PS debugginga rear I/O Ethernet port, a USB to UART channel based on an FTDI chip and a PCIe X4 interface multiplexed with the X8 PCIe interfaceavailable via a JTAG header2× 4 GTY (Gigabit Transceiver Ultra High-Speed) linesEach line consists of one differential RX and TX pair.Transmission speeds of up to 25 Gbps are possible.

Channels8(optional)32(optional)
ADC resolution16 bit
Analog input range±10 V±20 V
DAC resolution16 bit
Analog output range±5 V±10 V
Simultaneous samplingSimultaneous conversion for all D/A channels.
Acquisition specificationsThe -3 dB limit of this input stage is at approx. 8 MHzOutput Configuration per BMC Device via SPI Interface from MPSoC (Zynq™ UltraScale+™).LTC2323IUFD-16 (Analog Devices)AD5547BRUZ (Analog Devices)< 1 µs1000 pF10 mAOutput range configurable per D/A channel.
Isolation & signalCan be used as single-ended or differential I/O · LVCMOS18 and LVDS

Board functionFPGAAnalog acquisition
Architecture standardPCI Express
Bus interfacePCI Express x8 Gen 3 complies with the PCI Express Base Specification, rev. 3.1.Optional PCI Express x4 Gen2 Link to MPSoC PS.PCI Express x8 Gen 3 Link from PCIe Card edge connector to MPSoC PL.

Power inputDepends on MPSoC design

Dimensions98 mm x 154 mmPeripheral Component Interconnect Express (PCIe), PCI Express CEM R3.0, Standard Height, shortened Half Length PCI Express Add-in Card (98.4mm x 153.50mm)
Weight0.3 kg

Storage temperature-55–85 °C
MTBF104000 h

CertificationsRoHS

Operating systemsVxWorks(optional)Windows(optional)Linux(optional)QNX(optional)

Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.

Family configurations

The order codes of this family: the sheet applies to all of them, the detail of each configuration is in the datasheet.

Configuration (PN)
TPCE646-SW-25_PCIE
TPCE646-SW-42_PCIE
TPCE646-SW-65_PCIE
TPCE646-SW-82_PCIE
TPCE646-SW-95_PCIE
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