GAP-151R-S9-SOLO1U Single Socket Rugged Edge Server
- Manufacturer
GAP is a product family of rugged aluminium Servers and Workstations designed for edge applications that require a robust MIL-grade certified computing platform, suitable for operations in critical environments. The GAP S9 SOLO Series Rugged Edge Servers are equipped with single-socket Intel® Xeon® 6 Processors optimized to deliver new levels of performance across the greatest range of workloads, while offering improved efficiency and lower power consumption. With an innovative modular x86 architecture, the Intel® Xeon® 6 Processor family supports two distinct CPU microarchitectures: Performance-cores (P-cores) deliver outstanding performance across diverse workloads, ideal for AI and HPC applications, while Efficient cores (E-cores) offer high core density and excellent performance per watt. The GAP S9 SOLO Series Rugged Edge Servers are offered in 1U, 2U and 3U heights and are available in three configurations. Built to meet MIL-STD-810F standards for temperature and shock resistance, as well as MIL-STD-167-1A standards for vibration tolerance, GAP Rugged Edge Servers ensure reliable operation under the challenging conditions often found at the Edge. Additionally, they can optionally be configured to comply with MIL-STD-461 standards for EMI/EMC, featuring MIL-grade connectors for either the power input or both the I/O connectors and power supply inputs.
At a glance
- Single Socket
- 510mm Depth
- Rear I/O
- Rear PSU
A GOMA ELETTRONICA division
A GOMA RUGGED SOLUTIONS product
The GAP series belongs to GOMA RUGGED SOLUTIONS, GOMA's division for MIL-STD qualified systems. The full datasheet for this model, with configurations and qualifications, lives on its own site.
Visit GOMA RUGGED SOLUTIONSTechnical data
Finishes
Standard colours. Other RAL finishes on request from our engineering team.
- RAL 9005Jet black
Technical specifications
| CPU socket count | 1 |
|---|---|
| CPU class | Intel Xeon |
| Processor | Intel® Xeon® 6700/6500-series processors with P-cores or Intel® Xeon® 6700 processor with E-cores, and a thermal design power (TDP) of up to 225 W |
| Chipset | SoC |
| Graphics | 1x ASPEED AST2600 BMC |
| TPM | Header (provision) |
| Memory | Up to 2TB Registered DIMM DDR5-6400MT/s in 8 DIMM slots |
|---|---|
| RAM type | DDR5 |
| Maximum RAM | 2 TB |
| Storage | On board: 2x PCIe 5.0 x2 M.2 NVMe slots in the 2280 and 22110 form factors Removable: Up to 6x U.2 NVMe SSDs or Up to 9x 2.5” SATA SSDs |
|---|
| Ethernet ports | 1x Dedicated IPMI LAN port and 2x 10GbE ports supported by Intel X550 |
|---|---|
| Other I/O | 1x VGA, 2x USB 3.2, 2x 10GbE LAN, 1x BMC_LAN; 1x COM (available on the rear panel) |
| IPMI management | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
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| Expansion | 2x PCIe 5.0 x16 slots FHFL 1x PCIe 5.0 x16 slot – 1x LP |
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| Power input | AC or DC Redundant Power Supply – Optional AC Single |
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| Rack units | 1 U |
|---|---|
| I/O and power layout | Rear I/O and power |
| Dimensions | 483 x 44 x 510 mm 540 mm full depth |
| Chassis material | Aluminum with surface passivation treatment |
| Mounting | Rack Mount |
| Operating temperature | 0–50 °C |
|---|---|
| Storage temperature | -40–70 °C |
| Cooling | Fan (active) |
| Certifications | MIL-STD-461RoHSREACHMIL-STD-810 |
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| Operating systems | WindowsWindows 10 IoTWindows 11 IoT |
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Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Documentation
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