GAP-245P-S92U Dual Socket Rugged Edge Server
- Manufacturer
GAP is a product family of rugged aluminium Servers and Workstations designed for edge applications that require a robust MIL-grade certified computing platform, suitable for operations in critical environments. The GAP S9 series rugged edge servers are equipped with dual-socket Intel® Xeon® 6 Processors optimized to deliver new levels of performance across the greatest range of workloads, while offering improved efficiency and lower power consumption. With an innovative modular x86 architecture, the Intel Xeon 6 family supports two distinct CPU microarchitectures: Performance-cores (P-cores) deliver outstanding performance across diverse workloads, ideal for AI and HPC applications, while Efficient cores (E-cores) offer high core density and excellent performance per watt. Built to meet MIL-STD-810F standards for temperature and shock resistance, as well as MIL-STD-167-1A standards for vibration tolerance, GAP rugged edge servers ensure reliable operation under the challenging conditions often found at the edge. Additionally, they can optionally be configured to comply with MIL-STD-461 standards for EMI/EMC, featuring MIL-grade connectors for either the power input or both the I/O connectors and power supply inputs.
At a glance
- Dual Socket
- 450mm Depth
- Front I/O
- Front PSU
A GOMA ELETTRONICA division
A GOMA RUGGED SOLUTIONS product
The GAP series belongs to GOMA RUGGED SOLUTIONS, GOMA's division for MIL-STD qualified systems. The full datasheet for this model, with configurations and qualifications, lives on its own site.
Visit GOMA RUGGED SOLUTIONSTechnical data
Finishes
Standard colours. Other RAL finishes on request from our engineering team.
- RAL 9005Jet black
Technical specifications
| CPU socket count | 2 |
|---|---|
| CPU class | Intel Xeon |
| Processor | Dual Intel® Xeon® 6700/6500-Series Processors with P-Cores and Intel® Xeon® 6700-Series Processors with E-Cores (in LGA 4710 Socket E2) with three UPIs (24 GT/s max.) and a thermal design power (TDP) up to 270W. |
| Chipset | SoC |
| Graphics | 1x ASPEED AST2600 BMC |
| TPM | Header (provision) |
| Memory | Up to 4TB Registered DIMM, DDR5 6400MT/s in 16 DIMM slots |
|---|---|
| RAM type | DDR5 |
| Maximum RAM | 4 TB |
| Storage | Internal: 2x PCIe 5.0 x4 NVMe M.2 slots M-Key 2280 and 22110 form factors |
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| Ethernet ports | 1x Dedicated IPMI LAN port 2x 10GbE ports supported by Broadcom 57416 |
|---|---|
| Other I/O | 2x 10 GbE LAN, 1x BMC LAN, 4x USB 3.0, VGA, COM (available on the front panel) |
| IPMI management | IPMI2.0, SPM, Watchdog; SNMP and e-mail alarms and notifications |
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| Expansion | 2x PCIe 4.0 x16 – 2x FHFL |
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| Power input | AC or DC Redundant Power Supply – Optional AC Single |
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| Rack units | 2 U |
|---|---|
| I/O and power layout | Front I/O and power |
| Dimensions | 483 x 88 x 450 mm |
| Chassis material | Aluminum with surface passivation treatment |
| Mounting | Rack Mount |
| Operating temperature | 0–50 °C |
|---|---|
| Storage temperature | -40–70 °C |
| Cooling | Fan (active) |
| Certifications | RoHSMIL-STD-810REACHMIL-STD-461 |
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| Operating systems | Windows 11 IoTWindows 10 IoTWindows |
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Data extracted from the manufacturers' technical sheets: the official product spec sheet remains the reference for final confirmation.
Documentation
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